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Mijing 3D BGA Solder Reball Tin Plant Net, Model:A13

SKU: EDA003210906
Sale Sold out Pre-order
Regular price R 339.00
Regular price Sale price R 339.00
Pay in 3, 6, or 12 monthly instalments with

Import Taxes & Duties Included

6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

The Mijing 3D BGA Solder Reball Tin Plant Net is a BGA stencil designed for soldering applications. It is suitable for both novice and experienced users, providing a high success rate in forming solder balls.

  • Product Type: BGA Stencil
  • Model: A13
  • Compatibility: A13
  • Material: Not specified
  • Key Feature: Easy to use
  • Design: Square holes for easy removal of formed solder balls
  • Thickness: Thicker than ordinary stencils, reducing deformation
  • Durability: Longer lifespan due to reduced tendency of deformation
  • Category: Repair Tools
  • Portability: Compact and portable design

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