1 of 6

BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11

SKU: TBD04266910
Sale Sold out Pre-order
Regular price R 1,099.00
Regular price Sale price R 1,099.00
Pay in 3, 6, or 12 monthly instalments with

Import Taxes & Duties Included

6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

The BaKu 3D BGA CPU Tin Planting Mesh is a repair platform designed for BGA tin planting on motherboards. It provides precise positioning for professionals working on iPhone A11 repairs.

  • Product Type: Repair Platform
  • Compatibility: iPhone A11
  • Material: High temperature resistant
  • Key Feature: Precise positioning
  • Dimensions: 85 x 85 x 15 mm
  • Weight: 376 grams
  • Intended Use: BGA tin planting
  • Durability: High strength, resistant to deformation

PMC TechLife is an independent retailer. Any third-party trademarks or brand names mentioned are the property of their respective owners and are used strictly to indicate product compatibility.

Questions about features, compatibility, or warranty? Chat with our local support team!