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SSOP8 OTS-28-0.65-01 Chip Adapter Socket
SSOP8 OTS-28-0.65-01 Chip Adapter Socket
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Description
• Product type: MCU Tools
• Compatibility: SSOP8 OTS-28-0.65-01
• Material: PEI, PPS, beryllium copper
• Key feature: double contact technology
• Color/Variant: N/A
• Intended use: everyday use
• Category: Electronics Module
Features:1. Using double contact technology, the contact is more stable;2. The seat shell is made of special engineering plastic, which has high strength and long life;3. The shrapnel adopts imported beryllium copper material, which has low impedance and good elasticity;4. Thick gold-plated layer, thick electroplating of contacts, ultra-low contact impedance and high reliability; Product performance:1. Material: insulator PEI, PPS; shrapnel, beryllium copper Be Cu Gold plating (30u), Over Nickel plating (50u)2. Insulation resistance: 1000mohm, At DC 500V3. Withstand voltage: 700AC/1Minute4. Contact impedance: less than 25mohm5. PIN foot elasticity: 55g/PIN(Normal)6. Working temperature: minus 65-155 degrees Celsius7. Specifications and dimensions: pin spacing: 0.65 mm, pin position: 8, adaptable chip body width: 4.4 mm
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• Compatibility: SSOP8 OTS-28-0.65-01
• Material: PEI, PPS, beryllium copper
• Key feature: double contact technology
• Color/Variant: N/A
• Intended use: everyday use
• Category: Electronics Module
Features:1. Using double contact technology, the contact is more stable;2. The seat shell is made of special engineering plastic, which has high strength and long life;3. The shrapnel adopts imported beryllium copper material, which has low impedance and good elasticity;4. Thick gold-plated layer, thick electroplating of contacts, ultra-low contact impedance and high reliability; Product performance:1. Material: insulator PEI, PPS; shrapnel, beryllium copper Be Cu Gold plating (30u), Over Nickel plating (50u)2. Insulation resistance: 1000mohm, At DC 500V3. Withstand voltage: 700AC/1Minute4. Contact impedance: less than 25mohm5. PIN foot elasticity: 55g/PIN(Normal)6. Working temperature: minus 65-155 degrees Celsius7. Specifications and dimensions: pin spacing: 0.65 mm, pin position: 8, adaptable chip body width: 4.4 mm
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