Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508
Em promoção
Esgotado
Pre-order
Preço normal
R 289.00
Preço normal
Preço de saldo
R 289.00
Preço unitário
por
Envio calculado na finalização da compra.
Ships in 1-3 Days
Estimated delivery:
✓ Delivered Duty Paid: No additional customs charges. All duties and taxes are included.
Não foi possível carregar a disponibilidade de recolha
Guaranteed Safe Checkout
Guaranteed Safe Checkout
Descrição
1. These templates can be heated for re-filling BGA unit chips, which is very simple and quick
2. It solves the problems encountered by computer maintenance engineers when using directly heated steel nets. It is durable and long-lasting
3. The success rate of tin planting is high. After proficient operation, solder balls can be formed in one go, and it is simple and convenient to use
4. High quality materials, resistant to high temperatures and wear and tear
5. Material: stainless steel
